MBO B760M DS3H AX DDR5 GIGABYTE

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MBO B760M DS3H AX DDR5 GIGABYTE • Intel LGA 1700 Socket: Supports 13th and 12th Gen Intel Core Series Processors • DDR5 Compatible: Dual Channel DDR5, 4 DIMMs • Sturdy Power Design: 6+2+1 Hybrid Digital VRM Design • Comprehensive Thermal Design: M.2 Thermal Guard • Next Gen Connectivity: PCIe 4.0, NVMe PCIe 4.0 x2 M.2, USB 3.2 Gen 2 Type-C • Fast Networking: 2.5GbE LAN, WiFi 6E • Fine Tuning Features: RGB FUSION 2.0, Supports Addressable LED & RGB LED Strips, • Smart Fan 6, Q-Flash Plus Update BIOS without installing, CPU, Memory, and GPU Model Brand GIGABYTE Model B760M DS3H AX Supported CPU CPU Socket Type LGA 1700 CPU Type Support for the 13th and 12th Generation Intel Core, Pentium Gold and Celeron Processors Chipsets Chipset Intel B760 MBO B760M DS3H AX DDR5 GIGABYTE Memory Number of Memory Slots 4x288pin (DDR5) Memory Standard Support for DDR5 7600(O.C.) /7400(O.C.) /7200(O.C.) /7000(O.C.) /6800(O.C.) /6600(O.C.) / 6400(O.C.) / 6200(O.C.) / 6000(O.C.) / 5800(O.C.) / 5600(O.C.) / 5400(O.C.) / 5200(O.C.) / 4800 / 4000 MT/s memory modules Maximum Memory Supported 128GB Channel Supported Dual Channel Memory Feature 4 x DDR DIMM sockets supporting up to 128 GB (32 GB single DIMM capacity) of system memory Dual channel memory architecture Support for ECC Un-buffered DIMM 1Rx8/2Rx8 memory modules (operate in non-ECC mode) Support for non-ECC Un-buffered DIMM 1Rx8/2Rx8/1Rx16 memory modules Support for Extreme Memory Profile (XMP) memory modules Expansion Slots PCI Express 4.0 x16 1 x PCI Express x16 slot, supporting PCIe 4.0 and running at x16 PCI Express x1 2 x PCI Express x1 slots, supporting PCIe 3.0 and running at x1 Storage Devices SATA 6Gb/s 4 x SATA 6Gb/s M.2 CPU: 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2A_CPU) Chipset: 1 x M.2 connector (Socket 3, M key, type 2280 PCIe 4.0 x4/x2 SSD support) (M2P_SB) SATA RAID 0/1/5/10 Onboard Audio Audio Chipset Realtek Audio CODEC High Definition Audio Audio Channels 2/4/5.1/7.1-channel * You can change the functionality of an audio jack using the audio software.To configure 7.1-channel audio, access the audio software for audio settings. Onboard LAN LAN Chipset Realtek 2.5GbE LAN chip Max LAN Speed 2.5Gbps Wireless LAN Wi-Fi 6E Bluetooth Yes Rear Panel Ports Back I/O Ports 2 x USB 2.0/1.1 ports 1 x PS/2 keyboard/mouse port 2 x SMA antenna connectors (2T2R) 1 x HDMI port 2 x DisplayPorts 3 x USB 3.2 Gen 1 ports 1 x USB Type-C port, with USB 3.2 Gen 2 support 1 x RJ-45 port 3 x audio jacks Internal I/O Connectors Onboard USB 1 x USB 3.2 Gen 1 header 2 x USB 2.0/1.1 headers Other Connectors 1 x CPU fan header 3 x system fan headers 1 x addressable LED strip header 1 x RGB LED strip header 2 x M.2 Socket 3 connectors 4 x SATA 6Gb/s connectors 1 x front panel header 1 x front panel audio header 1 x Trusted Platform Module header(For the GC-TPM2.0 SPI/GC-TPM2.0 SPI 2.0 module only) 1 x S/PDIF Out header 1 x Q-Flash Plus button 1 x reset jumper 1 x Clear CMOS jumper Physical Spec Form Factor Micro ATX Dimensions (W x L) 24.4cm x 24.4cm Power Pin 1 x 24-pin ATX main power connector 1 x 8-pin ATX 12V power connector Windows Compatibility Windows 11 Supported MBO B760M DS3H AX DDR5 GIGABYTE Features Features Unique Features: Support for GIGABYTE Control Center (GCC) * Available applications in GCC may vary by motherboard model.Supported functions of each application may also vary depending on motherboard specifications. Support for Q-Flash Support for Q-Flash Plus BIOS: 1 x 128 Mbit flash Use of licensed AMI UEFI BIOS PnP 1.0a, DMI 2.7, WfM 2.0, SM BIOS 2.7, ACPI 5.0